Bond & Seal

Adhesive bonding eliminates the need for mechanical fasteners, protects critical components and can help reduce stress and weight. 

Bonding Applications

There are many applications where bonding is required:

  • Die Attach/Die Attach Film 
  • Lid Attach    
  • Optical Bonding:   
    • Fiber to ferrule bonding 
    • Precision optics attach 
    • LED encapsulants 
    • Small potting/encapsulation for opto-sensors 
    • MED grade optic bonding 
    • Optical bonding for display cell  
  • PCB Assembly Bonding:   
    • Chip/component bonding on PCB 
    • Flex circuit bonding to PCB 
    • Heat sink bonding  
    • Casing bonding and sealing

What Solutions Are Available?

  • Low Outgassing Epoxy (Nasa ASTM E595, MIL-STD-883/5011, Telcordia GR-1221)
  • UV Resistant Adhesives   
  • Biocompatible/Medical Adhesives (ISO 10993 Biocompatibility testing of adhesives)    
  • Optical Bonding for Display (< 1% volume shrinkage, stable optical properties after 1000 hours at 85°C/85% RH) 
  • Thermally Conductive/ Electrically Insulating Adhesives 
  • Thermally & Electrically Conductive Adhesives 
  • MEMS Die Attach Adhesives 
  • Hybrid Microelectronic Semiconductor Die Attach Adhesives (“HI-REL” die attach adhesive 
  • Low-Temperature Cure Die Attach Adhesive  
  • Fast Curing Die Attach Adhesive  
  • Fast Green Strength Adhesive  
  • Reactive Hot-melt 
  • UV Curing Adhesives  
  • Structural Adhesives 

What to Consider When Choosing an Adhesive?

  • What substrates are you bonding together?   
  • What is the required adhesion strength?   
  • Compliance with industrial standard(s)?
  • How is the product being applied?   

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Our technical team is ready to assist you with your critical application.