Thermal management plays a crucial role as the electronic component density on circuit boards increases. Thermal Interface Materials (“TIMs”) dissipate heat, allowing greater miniaturization and reliable performance.
TIMs are commonly used for semiconductor packaging, heat sink electronics, and high-powered devices like transformers, used in electronics and various industries such as aerospace and defense, automotive, optical, telecom, and industrial, medical, and oil & gas.
What Solutions Are Available?
Thermal interface material are available by chemistries (polyurethane, epoxy, and silicone) or by curing systems (room temperature cure, heat cure) which include the following TIM application systems:
- Thermally conductive adhesive
- Thermally and electrically conductive adhesive
- Thermal gap filler
- Thermally conducive potting
- Phase change
- Printable thermal pad
- Thermal compound
- Thermal tape
What Factors Should Be Taken Into Account When Choosing Suitable Thermal Interface Materials?
- Thermal Conductivity
- Category of TIMs
- Curing
- Industrial Standard Compliance
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