From semiconductor packaging to printed circuit board assembly level, polymer coatings or encapsulation systems such as Die Coating (encapsulants), Conformal Coating, and Potting are necessary to protect fragile die and wire bonds. The epoxy systems provide mechanical reinforcement and shield against harsh environments, contaminants and residue resulting in the significant increase the component’s lifecycle.
What Electronic Solutions Are Available?
Electronic Solutions are available by chemistries (Acrylic, polyurethane, epoxy, and silicone) or by curing systems (room temperature cure, heat cure, UV cure, or UV dual cure) which include the following application systems:
- Die coat or die encapsulant
- Dam and fill
- Conformal coating (thin layer conform contours of PCB)
- Potting (thick layer material in a mold or casting for full protection)
What Factors Should Be Taken Into Account When Choosing Suitable Polymer Coating or Encapsulation?
- Does your application require protection by insulating and/or concealing circuitry, components, and devices?
- What is the required thickness?
- Is it in compliance with industry standards?
- What is your application process?
What Factors Should Be Taken Into Account When Choosing Suitable Polymer Coating or Encapsulation?
- Protect by insulating and/or concealing circuitry, components, and devices
- Thickness
- Compliance of Industrial Standard
- Process
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